13 Juillet – Thesis defense - Aurore Quélennec
14 h Amphi Jean-Paul Dom - Laboratory IMS / Building A31 (University of Bordeaux)
Embedded sensors for microelectronics packaged module reliability
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IBM is combining forces with the Université de Sherbrooke to introduce intelligency, which are sensors, in microelectronics module. The project is to make the assembly process of a chip more robust thanks to the sensor data. These microelectronics module are used in high-performance computing servers or telecommunications.
The objectives are to design, characterize and embed 109 micro-sensors, having dimensions below 1 x 100 x 100 µm3. These micro-sensors will be on chip and measure temperature, moisture and strain. Thus these micro-sensors will give the spatial distribution of temperature, moisture and strain into the microelectronics module in severe environments. The carbon nanotube-based sensor realized are very sensitive to moisture and temperature, as example the output quantity value of the sensors is reduced by 50 per cent with a temperature excursions from -40 to 140 ℃. I developed a novel method to separate the temperature response from the moisture one, using the impedance properties of the sensor.
