05 Juillet – Thesis defense - Emmanuel Tetsi

08 h30 Salle P1002 - Université de Sherbrooke (Canada)

Development of thin films based on dielectric nanoparticles and optimisation of the deposition conditions for the fabrication of decoupling capacitors used in high density electronic modules assembling.

Within the three-dimensional (3D) integration associated with the use of an increasing amount of integrated circuits (ICs), there is strong need of high capacitance density (≥ 1 μF.cm-2) decoupling capacitors, able to operate on large frequency bandwidth, in order to reduce the noise that can compromise the signal integrity in ICs. The main challenge of these capacitors relies on the deposition of thin films (≤ 100 nm) using innovative materials with high relative permittivity (ε_r > 200 à 1 GHz) and «low cost» technologies compatible with large scale integration.
On one hand, the proposed approach in this thesis benefits from the possibility of synthetizing – by the supercritical fluid technology – and using Ba0.6Sr0.4TiO3 (BST) nanoparticles (Ø = 16 ± 2 nm, ε_r = 260 at1 kHz) as dielectric material and on the other hand, from the use of spray coating as technique for the deposition of these materials as thin films. First of all, the BST nanoparticles synthesized are functionalized with specific ligands (3-aminopropylphosphonic acid, APA), in order to obtain colloidal suspensions composed by aggregates with size (Ø < 100 nm) showing few fluctuations during two months. The other function of ligands is to improve the adhesion of the deposited films (self-assembling) on the copper (Cu) substrate. Different solvent are studied for the preparation of the solutions : N-méthyl-2-pyrrolidone (NMP), water, methanol and ethanol. The variation of different parameters related to the solution and the deposition technique helped us to define the optimal conditions leading to different thickness of film (200 – 1000 nm) based on pristine (BST) and functionalized nanoparticles (BST-APA). Using ethanol instead of NMP as solvent, enabled us to prevent de formation of a copper oxide layer and organic residues. After deposition of aluminum pads (Al) on BST or BST-APA films and used as top electrode, the capacitance-voltage (C-V) and current-voltage (I-V) characteristics of capacitors with metal-insulator-metal (MIM) structure enabled us to achieve high capacitance density (~ 0.7 μF.cm-2) and low leakage current (~ 25 μA.cm-2) at 1 V.
Keywords: MIM capacitors, thin films, supercritical fluids, Ba0.6Sr0.4TiO3, spray coating, nanofabrication in cleanroom.

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